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Package Development Engineer (m/f)

Job No. 001737

Position Type:

Research & Development

Working Time:

Regular Fulltime

Job description / tasks and responsibilities:

  • Development of IC packaging concepts for novel sensor systems
  • Construction of package architectures
  • Material selection and characterization
  • Management of package development projects and project sub-teams
  • Providing the interface to IC design, test and quality
  • Working in team-oriented atmosphere with a strong focus on thorough documentation and completing projects timely and successfully
  • Setting expectations by updated and detailed work plans. Identifying gaps, issues and needs to resolve and to successfully complete the project
  • Submitting new innovative process and system concepts as patent proposals


  • Advanced university degree in physics, material science, or related
  • Material characterization and failure analysis techniques
  • Computer aided design software skills
  • Work experience in an industrial environment, preferred in IC packaging
  • Creativity and problem solving skills
  • Good knowledge of MEMS and CMOS manufacturing technologies
  • Fluent in English

Place of Employment:

Premstaetten / Austria / Europe

Collective salary and wage agreement:

We offer competitive salaries and additional

based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G

We offer a higher compensation depending on your expertise and skills.

Über dieses Unternehmen

ams AG

Schloß Premstätten, Tobelbader 30
8141 Unterpremstätten

88 Jobangebote

Über diesen Job

Package Development Engineer (m/f)



Engineering | IT-Technik


Mitarbeiter | Angestellter


1 Job

Package Development Engineer (m/f)

bei ams AG

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